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Article-No.:
275136
Manufacturer-No.:
KD5AGUA80-60B280G
EAN/GTIN:
4895194968931
Technical specifications
Description
Technical specifications
General
Packaged Quantity
1
RAM
Type
DRAM
Technology
DDR5 SDRAM
Data Integrity Check
On-die ECC
Supply Voltage
1.4
Form Factor
DIMM 288-pin
Module Configuration
2048 x 64
CAS Latency
CL28
Memory Specification Compliance
PC5-48000
Chips Organization
2048 x 8
Registered or Buffered
Unbuffered
RAM Features
Microchip Technology Microcontroller Unit (MCU), 10-layer PCB, Aluminum heatsink, Intel Extreme Memory Profiles (XMP 3.0), Built-in Power Management IC (PMIC), Thermal sensor, AMD EXPO
Module Height (inch)
1.7
Latency Timings
28-36-36-76
Storage Capacity
32 GB
Product Type
Memory kit
Memory Module
Modules in Kit
2
Dimensions & Weight
Width
133,3 mm
Depth
8 mm
Height
44 mm
Weight
50 g
Service & Support
Type
Limited lifetime warranty
Description
The Essencore Klevv CRAS V RGB memory kit offers a total capacity of 32 GB, ensuring smooth multitasking and enhanced performance for demanding applications and gaming experiences. Each module is constructed with DDR5 SDRAM technology, supporting a data transfer rate of 6000 MT/s and on-die ECC for reliable data integrity. With a CAS latency of CL28 and compliance with PC5-48000 standards, this memory kit delivers speed and efficiency, making it a choice for modern systems.
Designed with user-friendly features, this kit comes equipped with Intel Extreme Memory Profiles (XMP 3.0) and AMD EXPO, simplifying overclocking and performance tuning. Additionally, each module includes an aluminum heatsink for optimized cooling, a 10-layer PCB for effective signal integrity, and a built-in Power Management IC (PMIC) to enhance power efficiency. Whether upgrading an existing system or building a new one, this memory kit provides performance and reliability.
Designed with user-friendly features, this kit comes equipped with Intel Extreme Memory Profiles (XMP 3.0) and AMD EXPO, simplifying overclocking and performance tuning. Additionally, each module includes an aluminum heatsink for optimized cooling, a 10-layer PCB for effective signal integrity, and a built-in Power Management IC (PMIC) to enhance power efficiency. Whether upgrading an existing system or building a new one, this memory kit provides performance and reliability.
- Robust performance
With a total capacity of 32 GB and a data transfer rate of 6000 MT/s, this memory kit is designed to handle demanding tasks and enhance overall system performance. - Efficient cooling
Each module is equipped with an aluminum heatsink and a thermal sensor to maintain optimal operating temperatures during high-intensity usage. - User-friendly overclocking
Supports Intel Extreme Memory Profiles (XMP 3.0) and AMD EXPO, allowing users to easily overclock and optimize performance without complex configurations. - Reliable data integrity
On-die ECC technology ensures that data is accurate and reduces the likelihood of errors during intensive operations. - Advanced design
Constructed with a 10-layer PCB and built-in Power Management IC, this memory kit provides enhanced signal integrity and power efficiency.
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Information on Product Safety
Information on Product Safety
Manufacturer information
Company Name
ESSENCORE Limited
Address
18 Harbour Road
SUITE 4006, 40F, CEN Wanchai HK
syjung@essencore.com
EU Responsible Person
Name
Siewert & Kau Technologies Vertriebs GmbH
Address
Walter-Gropius-Straße 12a
50126 Bergheim DE
info@siewert-kau.de