Klevv CRAS V RGB - DDR5 - kit - 32 GB: 2 x 16 GB - DIMM 288-pin / PC5-48000 - unbuffered

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Article-No.:
275136
Manufacturer-No.:
KD5AGUA80-60B280G
EAN/GTIN:
4895194968931

Technical specifications

General

Packaged Quantity
1

RAM

Type
DRAM
Technology
DDR5 SDRAM
Data Integrity Check
On-die ECC
Supply Voltage
1.4
Form Factor
DIMM 288-pin
Module Configuration
2048 x 64
CAS Latency
CL28
Memory Specification Compliance
PC5-48000
Chips Organization
2048 x 8
Registered or Buffered
Unbuffered
RAM Features
Microchip Technology Microcontroller Unit (MCU), 10-layer PCB, Aluminum heatsink, Intel Extreme Memory Profiles (XMP 3.0), Built-in Power Management IC (PMIC), Thermal sensor, AMD EXPO
Module Height (inch)
1.7
Latency Timings
28-36-36-76
Storage Capacity
32 GB
Product Type
Memory kit

Memory Module

Modules in Kit
2

Dimensions & Weight

Width
133,3 mm
Depth
8 mm
Height
44 mm
Weight
50 g

Service & Support

Type
Limited lifetime warranty

Description

The KLEVV CRAS V RGB is the next generation of DDR5 Gaming RAM designed for AAA games offering unparalleled performance, speed, flexibility and RGB colour support customisation. Engineered for ground-breaking performance and extreme overclocking the CRAS V RGB DDR Memory Modules can reach speeds of up to 8000 MHz, KLEVV's fastest card yet! Made from premium materials including high-quality, refined aluminium for the heatsink to ensure effective and efficient thermal conductivity. The compact size and design mean installation is hassle-free, with a height of just 44mm, the CRAS V RGB offers low clearance to maximize your freedom in selecting ideal configuration.
  • Robust performance
    With a total capacity of 32 GB and a data transfer rate of 6000 MT/s, this memory kit is designed to handle demanding tasks and enhance overall system performance.
  • Efficient cooling
    Each module is equipped with an aluminum heatsink and a thermal sensor to maintain optimal operating temperatures during high-intensity usage.
  • User-friendly overclocking
    Supports Intel Extreme Memory Profiles (XMP 3.0) and AMD EXPO, allowing users to easily overclock and optimize performance without complex configurations.
  • Reliable data integrity
    On-die ECC technology ensures that data is accurate and reduces the likelihood of errors during intensive operations.
  • Advanced design
    Constructed with a 10-layer PCB and built-in Power Management IC, this memory kit provides enhanced signal integrity and power efficiency.
There is no liability or guarantee that all information is complete, correct and up to date at all times.
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