KLEVV RAM Cras V RGB Obsidian Black- 32 GB (2 x 16 GB Kit) - DDR5 6000 UDIMM CL28

Article-No.:
275136
Manufacturer-No.:
KD5AGUA80-60B280G
EAN/GTIN:
4895194968931
WEEE Nummer
DE83654239
Technical specifications

General

Packaged Quantity
1

RAM

Type
DRAM
Technology
DDR5 SDRAM
Data Integrity Check
On-die ECC
Supply Voltage
1.4
Form Factor
DIMM 288-pin
Module Configuration
2048 x 64
Memory Speed
6000 MHz
CAS Latency
CL28
Memory Specification Compliance
PC5-48000
Chips Organization
2048 x 8
Registered or Buffered
Unbuffered
RAM Features
Microchip Technology Microcontroller Unit (MCU), 10-layer PCB, Aluminum heatsink, Intel Extreme Memory Profiles (XMP 3.0), Built-in Power Management IC (PMIC), Thermal sensor, AMD EXPO
Module Height (inch)
1.7
Latency Timings
28-36-36-76
Storage Capacity
32 GB
Product Type
Memory kit

Memory Module

Modules in Kit
2

Dimensions & Weight

Width
133,3 mm
Depth
8 mm
Height
44 mm
Weight
50 g

Miscellaneous

RGB
Description
6000MT/s Capacity 64GB - Kit 2 X 32GB - Technology DDR5

The KLEVV FIT V DDR5 Memory features an ultra-low-profile design for
optimal compatibility and cost-effective performance. Designed for content
creators, it delivers low latency for quick responsiveness, smooth multitasking,
and reliable system performance under demanding workloads. With on-die
ECC and PMIC, it guarantees data integrity, power efficiency, and stability,
making it an excellent choice for creative, gaming, and high-performance
applications
  • Robust performance
    With a total capacity of 32 GB and a data transfer rate of 6000 MT/s, this memory kit is designed to handle demanding tasks and enhance overall system performance.
  • Efficient cooling
    Each module is equipped with an aluminum heatsink and a thermal sensor to maintain optimal operating temperatures during high-intensity usage.
  • User-friendly overclocking
    Supports Intel Extreme Memory Profiles (XMP 3.0) and AMD EXPO, allowing users to easily overclock and optimize performance without complex configurations.
  • Reliable data integrity
    On-die ECC technology ensures that data is accurate and reduces the likelihood of errors during intensive operations.
  • Advanced design
    Constructed with a 10-layer PCB and built-in Power Management IC, this memory kit provides enhanced signal integrity and power efficiency.
Information on Product Safety

Information on Product Safety

Manufacturer information

Company Name

ESSENCORE Limited

Address

18 Harbour Road

SUITE 4006, 40F, CEN Wanchai HK

Email

syjung@essencore.com

EU Responsible Person

Name

Siewert & Kau Technologies Vertriebs GmbH

Address

Walter-Gropius-Straße 12a

50126 Bergheim DE

Email

info@siewert-kau.de

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